Image resolution enhancement for advanced semiconductor nodes
Advanced semiconductor nodes are pushing the limits of feature sizes and require metrology with sub-nm resolution without compromising on the throughput as needed for in-line process control. Recently, high-throughput scanning probe microscopy (SPM) based metrology and inspection tools capable of meeting these needs have been introduced to the market and qualified for use in HVM. While innovative measurement methods and tool architecture have allowed for a leap of improvement in throughput, the next step in further reducing imaging time can be obtained through the application of machine learning for enhancing the resolution of measured images for extraction of relevant parameters. In this...
| Authors | Lucas Rencker, Omid Tajalizadehkhoob, Khalid Elsayed et al. |
|---|---|
| Primary category | cs.LG |
| Published | 5 October 2026 |
| Last updated at source | 5 October 2026 |
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