Topological Void Analysis A Mathematical Framework for Systematic Technical Innovation Discovery in Knowledge Spaces
Identifying where to innovate in a dense technical domain - such as operating systems or hardware/software co-design - is fundamentally a search problem in a high-dimensional knowledge space. Existing approaches rely on keyword search, citation proximity, or human intuition, none of which formalise the notion of an unexplored region that is simultaneously relevant to a target goal and absent from prior art. We present Topological Void Analysis (TVA), a mathematical framework that defines topological voids as triads (A, B, C) in a dense-sparse hybrid embedding space. A void requires three conditions: (i) both concepts A and B are semantically cohesive with domain anchor C; (ii) their pairw...
| Authors | Kris Pan |
|---|---|
| Primary category | cs.IR |
| Published | 20 April 2026 |
| Last updated at source | 20 April 2026 |
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