Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration
Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To examine how practitioners view this transition, an anonymous survey was distributed across a broad set of organizations involved in semiconductor design, packaging, systems, tools, & failure analysis. The survey collected approximately one hundred responses & probed organizational background, supported product domains, future priorities in failure analysis, critical bottlenecks, sample preparation challenges, emerging architecture specific pain points, & perceived needs for workflow acceleration & data standardiza...
| Authors | Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad et al. |
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| Primary category | cs.SE |
| Published | 20 June 2026 |
| Last updated at source | 20 June 2026 |
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